Pcb Epoxy Resin

Product Description

Packing Specification

Implementation Standard

Epoxy resin is a material that performs various functions in the manufacturing process of PCB for Internet of Things products. Here's more on the important role it plays in iot manufacturing.

Adjust to meet specific requirements

Manufacturers can choose special epoxies or change specific epoxy characteristics to meet specific performance or manufacturing requirements. For example, additives can make epoxy resins harder or thicker, making them best suited for use as conformal coatings. Here are some other ways to adjust the characteristics of a particular epoxy resin

Electrical and thermal conductivity

Using silver as a filler for one - or two-component epoxies can produce conductive adhesives instead of welding. Conductive binders are either isotropic or anisotropic. Those in the first category are conductive in all directions. Anisotropic binders, however, conduct electricity in only one direction. They are sometimes used to glue antenna structures in radio frequency identification (RFID) products.

Epoxy also helps with heat conduction. One option is to use this adhesive to connect two surfaces and transfer heat to the cooler surface. However, since most epoxies lack adequate intrinsic thermal management capabilities, fillers make up for the shortfall. Copper, boron nitride and aluminum powder significantly improved the heat transfer performance.

Extreme temperature tolerance

Additives and hardeners are also mixed with the epoxy during and before curing to make the adhesive resistant to low temperatures. In contrast, the epoxy resins that exist can withstand temperatures higher than the approximately 300 degrees Fahrenheit of non-extreme heat-resistant types.

Low release gas

Epoxy resins used in the aerospace industry must be of a low gas release type. Due to the vacuum of space, degassing causes volatile compounds to be released around the spacecraft.

NASA uses two test parameters to ensure that the epoxy meets degassing requirements: total mass loss (TML) and collected Volatile Condensable material (CVCM). More specifically, NASA standards specify less than 1% TML and less than 0.1% CVCM for epoxy adhesives or potting compounds.

Companies that supply low-release, high-purity epoxies first test these products in specialized chambers under strict conditions. Then they publish the results and cater to customers who want low gas release adhesives.

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